NXP CONNECT 2020就要来了（内含新鲜社招职位）
↑ 点击上方蓝字关注我们获取更多信息
NXP CONNECT 2020就要来了！
首届线上NXP Connects，为您提供100%的全新数字化体验，连接全球开发者社区，让您足不出户就可以洞悉汽车电子、边缘计算和安全连接领域的最新科技趋势，聆听恩智浦专家和行业意见领袖的真知灼见，与恩智浦生态链合作伙伴和全球创新开发者深度互动！
(点击下图了解详情)
现NXP Connects已开放注册！马上预约报名，锁定你心仪的课程，和我们共赴这场科技盛宴吧！
预约报名完来看看，
新鲜的热招职位吧！
↓ 如果你适合如下职位 ↓
请将简历投递至：talent@nxp.com
邮件注明：姓名+申请职位+工作城市
Senior Software Engineer – GPU
Location: Shanghai
(上下滑动启阅)
Responsibilities:
- Develop and deliver the qualified GPU software drivers for i.MX portfolio SW NPI releases.
Low level driver development for EGL, OpenGL ES, Vulkan, OpenCL, OpenVX, 2D, OpenVG, WebGL, etc.
- Linux-based graphics platform support for Android, Wayland.
- GPU bring-up with SoC simulation, function validation on silicon.
- Leading customer support for i.MX business driving.
Requirements:
- Bachelor degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Have 5-7 years of related working experience.
- Experienced with C/C++ programming on ARM embedded system with Linux/Android.
- Full understanding of the graphics pipeline.
- Development experience with OpenGL ES/Vulkan/Direct3D driver
- Knowledge on Android graphics framework including SKIA, HWC
- Linux driver development for hardware accelerators
- Plus to have DRM graphics or 2D driver experience.
- Fluent English read/write/speak capability
- Good spirit on teamwork.
Software Engineer – Wireless
Location: Shanghai
(上下滑动启阅)
Responsibilities:
- Develop WiFi device driver and firmware for Marvell wireless SoCs.
- Develop WiFi and BT/BLE Coexistence software for Marvell wireless SoCs.
- Develop system software and applications to enable advanced user cases utilizing Marvell WiFi technologies.
- Work on system integration and performance tuning of WiFi subsystems customer platforms.
- Support customers remotely or onsite as needed.
Requirements:
- Bachelor degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Fluent English read/write/speak capability
- Good spirit on teamwork.
Senior Software Application Engineer
- Wireless
Location: Shanghai
(上下滑动启阅)
Responsibilities:
- Support wireless software (Wi-Fi, tools, etc.) integration and bring-up on customer platforms.
- Debug and resolve wireless software issues reported by customers.
- Drive co-work with other teams (FAE, R&D, QA, etc.) to provide customer support timely.
- Support internal development and debug tasks from software perspective.
- Support customer remotely or onsite as needed.
Requirements:
- Bachelor degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Minimum 2 years’ related work experience is required.
- Experience with C programming and debugging is required.
- Experience with Linux kernel and driver development is required.
- Knowledge of Wi-Fi MAC and standard is required.
- Knowledge of TCP/IP protocol is required.
- Knowledge of other wireless technologies (Bluetooth, Zigbee, UWB, etc.) is preferred Knowledge of PCIe/SDIO/USB is preferred.
- Fluent English Good teamwork and communication.
- Willing to travel.
Senior Secure IoT Firmware Engineer
Location: Shanghai
(上下滑动启阅)
Responsibilities
- Work on the state-of-the-art technologies in industry-leading security and IoT products.
- Involve in multisite, multidisciplinary and multicultural projects with the global teams.
- Develop security certified products in the well-respected security certified environment.
- Define the features requirements and firmware specification with cross functional teams.
- Design, implement and integrate the firmware modules to meet challenging demands.
- Develop creative ideas and software countermeasures for security threats and attacks.
- Optimize under limited resource usage, low power consumption, and security constrains.
- Implement and extend test suites to ensure a quality delivery of the full-fledged firmware.
- Create and review the design and implementation documents by international standards.
- Support both internal stakeholders and external customers at expert level.
Requirements:
- Bachelor degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Minimum 3 years’ experience in embedded software development with 8/16/32-bit MCU architectures (e.g. RISC-V, ARM-Cortex).
- Excellent programming and debugging skills in C/C++/C#, assembly and Python languages.
- Solid low-level development experience with GCC/LLVM compiler and ELF file format.
- Proficiency in verification methodologies and automated scripts by Jenkins and FPGA.
- Experience in agile software development process and configuration management tools.
- Knowledge of crypto algorithms and security certification would be an added advantage.
- Enthusiastic, self-motivated, fast learning and ability to deliver under pressure.
- Good command of English, both written and spoken.
Senior Test Engineer
Location: Shanghai
(上下滑动启阅)
Responsibilities:
- Deploying multiple products in to High Volume Manufacturing
- Strategizing Test Platforms for both Short Term and Long Term Needs.
- Increasing the efficiency and productivity of the test engineering team by enhancing the test techniques.
- Be responsible for all aspects of test development, characterization, production implementation and hi-volume ramp up for Power Management and High Performance Analog Products.
- Demonstrated ability working with Design engineers at the product concept stage to ensure proper design of characterization setups, DfT, and product manufacturability.
- PCB design skills for developing ATE loadboards, handler, prober interface and specifications.
- Demonstrated ability to drive hi-volume product launch and production support.
- All administrative aspects of Test engineering, i.e. Test Specification writing, Customer support, data evaluation, report generation, setting test limits, production support, etc.
Requirements:
- Bachelor degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Minimum 5 years of test development experience on high performance Integrated Circuits.
- Good understanding of Analog and Digital Electronics
- Most recent experience on Advantest 93k PS, testers are a plus.
- Profound understanding of digital, analog, and mixed signal device testing, characterization, product launch, and support.
- Experience with Statistical Data Processing, DOEs, problem solving methodologies, demonstrated decision making skills, cost reduction, and yield enhancement.
- Understanding PCB design for developing ATE loadboards and specifications.
- Working knowledge/experience with foundries, subcons.
- Working knowledge of fab processes and effect on test.
- Skill required in reliability, failure analysis and circuit debug processes.
- Package development knowledge required.
- Demonstrated ability to work collaboratively with a diverse, global product development team from product concept, hi-volume production ramp up to product sustainability.
System & Architecture Engineer
on Battery Management System
Location: Tianjin & Shanghai
(上下滑动启阅)
Responsibilities:
- Promote existing product portfolio to potential new customers in order to grow market share, defining product derivatives when appropriate and providing guidance in their system architecture to match products performance.
- Support existing customers in helping them solve application and system specific issues that they may encounter during the lifetime of the product.
- Develop product demonstration kit, models and system solution for end customers, based on in-depth knowledge of Battery Management System and embedded systems.
- Work with customers, field sales, FAEs, product definers, design engineers and the product line manager to support a family of power products for the business unit to plan roadmaps, specify new products and secure design wins.
- Perform requirements analysis and tradeoffs, create system level requirements descriptions, and work with product definers to create product specifications. Perform deep competitive analysis and provide plans and directions to drive market based solutions.
- Create customer facing technical documents such as data sheets, application notes, contributed articles and conference papers and contribute to reference designs and demos.
Requirements:
- Bachelor degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Minimum 5 years’ experience of Automotive Electronics, and in-depth knowledge over System Architecture and IC components.
- Specific skillset and knowledge, including electronics HW&SW, Functional Safety or EMC validation & rectification.
- Skills and experience on market exploration with sense of urgency.
- Skills and experience on electronics design, as PCB hardware and software development. Knowledge on typical applications, as ECUs or modules in Automotive, Industry or Consumer market.
- Good academic background is admired, as R&D project experience and professional articles publish.
- Excellent communications skills, verbal and written. Fluent English is admired.
- Successful track record of customer satisfaction through direct customer technical support.
Customer Quality Engineer
Location: Tianjin
(上下滑动启阅)
Responsibilities:
- Manage customer return process including problem solving process.
- Provide follow-up on all customer failure analyses, communication and issue resolution at all levels.
- Act as customer advocate for product quality. This includes customer and internal management communications and presentations, for customer and internal quality reviews.
- Customer interaction and negotiation on quality cases solving.
- Customer loyalty development.
- Interface with internal and external factories on reliability and quality issues.
- Support continuous improvement, defect reduction activities, and cost reduction activities.
- Lead product teams, factories, and associated support through quality issue resolution process.
- Support customers with technical reliability and quality consult.
- Work with customers to address product reliability and quality issues.
- Coordinate and/or Participate in the Change Action Board (CAB).
- Participate in Material Review Boards (MRB).
Requirements:
- Bachelor degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Application Engineering or Design Experience on microprocessor
- Demonstrated data analysis and problem solving skills.
- Ability to resolve complex customer issues and lead cross-functional teams.
- Strong written and verbal communication and presentation skills and ability to influence others.
- Process control and other six sigma tools knowledge.
- Flexibility to adjust to change and multiple ongoing issues in a fast-paced, customer-focused environment.
- Ability to work independent of management with leadership skills.
- Application Engineering experience would be an advantage.
- Overseas education and/or working experience are preferred.
Field Quality Engineer
Location: Shenzhen
(上下滑动启阅)
Responsibilities:
- Full ownership of the assigned Customers in terms of achieving the FQE specific targets
- Be the Customer quality advocate for the assigned Customers
- Drive a positive Customer perception of NXP's Quality
- Execute the CQC reduction plan for the assigned Customers by:
o perform failure verification with the Customer to be able to identify the failure cause
o enable Customer engineers / technicians to perform an effective initial evaluation of NXP device
o assist the Customer in the resolution of Customer caused issues (e.g. ESD/EOS protection, parts programming, etc.)
o apply a diligent CQC data analysis for every return reported by the Customer to fully understand the device history
o identify any repeat occurrences possibly during FFV (field failure verification) and data mining
- Responsible for acquisition, implementation and maintenance of the required tools to ensure excellent FFV capability.
Requirements:
- Bachelor degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Excellent communication skills.
- Ability to work independently in the field.
- Good understanding of device- and ECU test philosophies.
- Practical knowledge of high level and assembler programming languages.
- Good understanding of analog and digital measuring techniques.
- Ability to work in a complex and demanding environment.
- Flexibility and ability to react quickly to support customers, incl. short notice travel.
- Fluent in English.
Field Application Engineer
Location: Shanghai,Beijing,Shenzhen,Chengdu
(上下滑动启阅)
Responsibilities:
- Support NXP’s MPU applications processors ( Layer Scape ) & solutions.
- Drive demand creation and design-in activity at customer sites in close cooperation with the NXP business lines.
- Provide technical skills & support to NXP’s sales staff and will work with the NXP technical community about technical issues and future roadmap of your customer.
- Work closely with sales, marketing to promote NXP MPU product & corresponding vertical solutions to customer.
- Major technical window to customer, provide project management to ensure customer project success.
- Provide technical supporting for processor benchmark & customer product design.
Requirements:
- Master degree, major in Electronic Engineering/Computer Science or other related discipline.
- Experienced on high performance ARM multi-core platform.
- Familiar with embedded hardware knowledge of high-speed I/O program include network accelerator, pcie etc.
- Deep understanding on Linux networking protocol.
- Linux programming, kernel and driver experience is must.
- Knowledge of wifi and 5G is plus.
- Excellent communication skills internally and externally, strong learning skill is a must.
- Good English in both oral & writing.
Senior FAE – Hardware
Location: Beijing
(上下滑动启阅)
Responsibilities：
- Supporting north China customers , UWB/NFC hardware implement.
- Managing customer projects.
- Working with the Sales/marketing team for application promotion and NPI.
- Working with QA for quality issues analysis.
- Involving Standard drafting and following up.
- Addressing the customer / disti engineer training
- Joining internal training for NPI.
Requirements：
- Master degree, major in Electronic Engineering/Computer Science or other related discipline.
- Strong experience in G-Hz RF and NFC hardware design/support, knowing related standard very well.
- Excellent communication skills internally and externally, strong learning skill is a must.
- Good English in both oral & writing.
Senior FAE – Software
Location: Shenzhen
(上下滑动启阅)
Responsibilities：
- Supporting south China customers , NFC/UWB software implement.
- Managing customer projects.
- Working with the Sales/marketing team for application promotion and NPI.
- Working with QA for quality issues analysis.
- Involving Standard drafting and following up.
- Addressing the customer / disti engineer training
- Joining internal training for NPI.
Requirements：
- Master degree, major in Electronic Engineering/Computer Science or other related discipline.
- Strong experience in G-Hz RF and NFC hardware design/support, knowing related standard very well.
- Excellent communication skills internally and externally, strong learning skill is a must.
- Good English in both oral & writing.
Design Engineer
Location: Shanghai
(上下滑动启阅)
Responsibilities:
- Create the RTL architecture for the algorithm.
- RTL coding, new logic design, simulation, synthesis.
- Work closely with algorithm engineer to develop/debug new IP.
Requirements:
- Master degree, major in Electronic Engineering/Computer Science or other related discipline.
- Minimum 3 years’ experience on IP simulation and debug process using VCS and Verdi.
- Very familiar with the Verilog HDL language, know VHDL is a plus.
- Design and test experience on MCU controller design is a plus.
- Very familiar with digital design EDA tools such as DC,PT,Formality.
- Familiar with the flow of the IC design.
- Strong communication skills.
SoC DFT Design Engineer
Location: Tianjin
(上下滑动启阅)
Responsibilities:
- Participate in definition of both chip level and block level design-for-test structure and methodology.
- Responsible for ATPG and model creation, memory Built in Self-test, Embedded Deterministic Test and Boundary Scan Test.
- Work closely with design engineer for design optimization for test coverage improvement, test volume and test time reduction.
- Responsible for scan/bist pattern simulation based on timing files and gate-level netlist.
- Work closely with Test Engineer to debug and solve scan/bist pattern failures on tester.
- Work as a global team to do complex SOC design and test.
Requirements:
- Bachelor degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Excellent communication skills internally and externally.
- Have strong learning skill.
- Good English in both oral & writing.
SoC Senior Validation Engineer
Location: Tianjin
(上下滑动启阅)
Responsibilities:
- Responsible for executing high speed interface compliance test for DDR/PCIe/HDMI/USB and etc.
- Debug any high speed interface design issues and reporting final test result.
- Perform high speed interface compliance test.
- Co-work with design and internal team for the high speed interface issue debugging and root cause analysis.
- Customer high speed interface issues support with internal team.
Requirements:
- Master degree, major in Electronic Engineering/Computer Science or other related discipline.
- Good experiences on high speed interface compliance test, like DDR, PCIe, USB and etc.
- Understanding of ARM based MPU(Coretx-A) architecture and system application.
- Familiar with embedded popular IDE tools, e.g. ADS/DS-5, IAR, Keil, CodeWarrior.
- Good at developing and debugging of the ARM based embedded system.
- Good at C coding and compiler, knowledge on IC design is a plus.
- Experience in automation environments such as LabView is a plus.
- Verilog/SystemVerilog HDL knowledge is a plus.
- Python or C++ programming skill is a plus.
- Good English reading, writing and communication skills.
- Excellent communication skill and team work oriented.
SoC Backend Design Engineer
Location: Tianjin
(上下滑动启阅)
Responsibilities:
- High performance Micro Processor physical design floorplan, Place&Route.
- Synthesis and Static Timing Analysis.
- Power integrity analysis and physical verification.
- Collaboration with global implementation teams and cross-functional teams.
Requirements:
- Bachelor or Master Degree or equivalent from Micro Electronics.
- Experienced in Digital SoC implementation.
- Expertise in at least one of these area, RTL design & verification, Synthesis, STA, Floorplan, P&R, Power integrity.
- Enthusiastic, creative, motivated and result-oriented.
Product / Test Engineer
Location: Tianjin
(上下滑动启阅)
Responsibilities:
- Work with Design, Device, Test, Application, Process and QA Engineers, to evaluated new product and new Wafer Fab and Assembly process.
- Perform and coordinate Reliability and Electrical test and Failure verification and Failure Analysis on the products.
- Develop, evaluate, and improve manufacturing methods, utilizing knowledge of product design, materials and parts, fabrication processes, tooling and production capabilities, assembly methods and quality control standards. Work flexible hours as required to meet project deadlines and manage department.
- Specification Configuration and management; administrative product management.
- Build and maintain traceability matrix.
- Manage characterization and qualification plan definition.
- Evaluate test coverage.
- Drive product characterization: collect and analyze data from lab and final test.
- Perform product qualification: reliability tests, ESD, Latch-up, etc…
- Set up production tools in final test (burn-in, ATE, dash boards…)
- Prepare CAB sessions and PPAP documents.
- Manage yield improvement, zero defect plans (PAT, SBL, JVT…) and Production ramp up and sustaining.
- CQC investigations (ATE test, lab analysis and FA lab follow up).
Requirements:
- Bachelor degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Minimum 3 years working experience of electronics engineering.
- Strong Analog Electronics competences with power device skills and automotive environment knowledge preferred.
- Test instrumentation techniques and methodology is a must.
- Basic statistical knowledge is a must, while having experience on SPC(Statistic Process Control) is a plus.
- Good command of English both in writing and speaking in a global working environment.
- Strong synthesis and analysis skills.
- Good leadership and teamwork, and be hard working and diligent.
Electronic Material Packaging Engineer
Location: Tianjin
(上下滑动启阅)
Responsibilities:
- Define and validate package designs, materials and processes used for development of new products for NXP. Develop DOE’s and tests to evaluate suitability and reliability of package solutions.
- Work with Product Business Lines, Global Package Innovation teams, Process engineering (both internal to NXP and subcons) and Suppliers to establish and conduct physical / chemical material selection characterizations for new materials and qualify the product-package solutions.
- Establish a strong understanding to certify reliable solutions of different metals and alloys integrated into IC leaded and laminate packaging systems.
- Apply advanced methods and technologies to research metal and plating properties improving techniques.
- Establish applicable analytical tools and test methodologies to ensure plating / metal integration.
- Manage the package process using industry standard project management tools.
- Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).
- Address and solve materials and processing issues that may occur during the development process.
- May involve international travel to package assembly sites and NXP suppliers.
Requirements:
- PhD. in Materials Science, Metallurgical Engineering or other related disciplines.
- Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
- Strong Problem-solving skills determining innovative ways to improve processes and resolve issues related to manufacturing and design
- Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.
- Knowledge of Statistical Analysis and Design of Experiment is a plus.
- Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.
往期职位
(点击文字查看职位推送)
You want more than just a job?
Build your career with NXP.
点一点告诉大家你也"在看" ↓